Solid Boron Nitride Grade AX05 is one of the highest purity hexagonal boron nitride solids available and a wise choice for applications where corrosion resistance is more important than wear resistance. It is a diffusion bonded ceramic and does not depend on B2O3 to other binders for mechanical integrity and, consequently, it is non-wet by almost all molten metals. This ultra purity advantage allows for applications and uses not provided by other hot pressed boron nitride solids, such as crucibles for high-purity molten metals. Commonly used in applications that demand very high thermal conductivity such as nozzles with small orifices.
Chemically – Grade AX05 is extremely inert and non-wet by many molten materials such as metals, glasses, halide salts and other reagents. The chemical stability allows Grade AX05 to provide a stable, non-reactive material for nozzles, feed- throughs, crucibles and supports.
Thermally – Grade AX05 has minimal thermal expansion, high thermal conductivity and use temperature in certain inert atmospheres over 2000°C. Thermal shock stability is excellent over a wide range of use temperatures.
Mechanically – Grade AX05 yields increasing relative strength vs. temperature. This important feature provides higher temperature performance to applications previously unattainable with B2O3 to other bonded boron nitrides.
Electrically – Grade AX05 is transparent to microwave energy. It also provides high resistivity and dielectric strength with a low loss tangent and dielectric constant. These characteristics make AX05 an excellent material for high power, low loss insulators, containers and fixtures.
Machinability – Grade AX05 can be machined to extremely close tolerances using standard high speed “tool steel” equipment. Machining by grinding may be used if preferred or stringent tolerances are required. Threads can be machined using taps and dies. Cutting oils and coolants should not be used for any reason.
- High temperature electrical insulators and vacuum furnace supports which require electrical resistivity, high temperature strength, thermal shock resistance and low chemical reactivity.
- Crucibles and containers for high purity molten metals Insulators and source fixtures for ion implantation systems which require high temperature purity and electrical insulation.
- Setter plates for the processing of other advanced materials which require stable, inert surfaces.
- Nozzles for powdered metal spraying.
|Binder Melting Point||None|
|Maximum Use Temperature|
|Specific Heat J/g℃:||0.35|
|Dielectric Strength:||1000 V|
|Pressing Direction (Para(Perp)||Para||Perp|
|Resistivity Ohm-cm RT:||>1014||>1016|
|Loss Tangent @ 8.8 GHz:||.0012||.0003|
|Dielectric Constant @ RT:||4.0||4.0|
|(W/m/L) @ 25℃:||78||130|
|Thermal Expansion Coefficient||Para||Perp|
|(RT to 1500℃) (in/in/℃ x 10-6); 1.0 (0.3)|
|Flexural Strength (psi)*||Para||Perp|
|Density (g/cc minimum):||1.85|
|% Open Porosity:||12.57%|
|Oxygen - max:||1%|
|Carbon - max:||0.02%|
|Calcium - max:||0.04%|
|Other Impurities - max:||0.05%|
Based on 4-pt bend test-Sample size = 51mm x 4mm x 3mm